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The next evolution of power electronics will center around high electron mobility transistors (HEMT). These HEMT devices are built using what is known as wide bandgap (WBG) semiconductors. WBG semiconductors have a much wide-bandgap between the valence band and the conduction band than conventional silicon semiconductors. For example, the bandgap energy of conventional silicon is about 1.5eV whereas gallium nitride (GaN) devices have about 3.5eV. Getting up to speed on these devices can be a challenge, which is why manufacturers provide reference designs.
Reference designs for wide bandgap semiconductors are just that and often need tweaking and tuning for your particular design needs. This webinar takes a look at the input and output decoupling/filtering networks for a GaN-based power stage and attempts to optimize the design for component count and size while still retaining the original functionality of the reference using eCADSTAR as the CAD platform.
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*This webinar is only available in North America
Electronics engineers, test engineers, quality assurance, sourcing managers, engineering managers.
Name:Wilmer Companioni
Title: Technical Marketing Manager, Zuken USA
Biography: Wilmer joined Zuken recently and prior to Zuken was Technical Marketing Manager for a passive component manufacturer and is also experienced in mobile device engineering with a brief stopover in sales. One of Wilmer’s main interests is to demystify electronic concepts and make them accessible and relevant to everyone.
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Sanu Warrier is a Technical Marketing Manager, helping customers find effective solutions to their design challenges. His work focuses on eliminating inefficiencies, improving design processes, and reducing costs to improve competitive advantages. He is a self-professed foodie and loves to dabble in gastronomic alchemy as often as possible.
Tim McDonald is President at Electro Magnetic Applications, Inc. (EMA). EMA is a leading developer of technologies for engineering simulation. EMA’s engineering specialty is applied electromagnetics. In this domain, EMA provides software and services to promote the design, certification, and performance of our customers’ products. Tim currently serves as product manager for EMA3D®. He supports EMA3D® users around the world from multiple industries.
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Title: President, EMA, Inc.
Biography:
Tim McDonald is President at Electro Magnetic Applications, Inc. (EMA). EMA is a leading developer of technologies for engineering simulation. EMA’s engineering specialty is applied electromagnetics. In this domain, EMA provides software and services to promote the design, certification, and performance of our customers’ products. Tim currently serves as product manager for EMA3D®. He supports EMA3D® users around the world from multiple industries.
Tim holds a Ph.D. in Applied Physics and Applied Math from Columbia University in the City of New York.
Tim previously led consulting engagements for NASA and DoD major primes pertaining to specialty engineering of critical systems, development of novel solutions to electromagnetic compatibility problems, and the execution of major programs that require verification of electromagnetic environmental effects.
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